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  • Post CMP cleaner
  • Post CMP cleaner

Post CMP cleaner

Advantages

- No TMAH chemicals

- PH value: 11 ~ 13

Explain
• Post CMP cleaner is a cleaner used to remove metal, organic residues, slurry and other impurities left on the wafer after CMP (chemical mechanical polishing).
Product details
  • Contact US
    Tel:400 828 5505
    Add:No. 930, Qingcun Town, Fengxian District, Shanghai
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